View MPXHZ6401A_4672673.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Pressure
Freescale Semiconductor Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXHZ6401A series pressure sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of onchip integration make this sensor a logical and economical choice for the system designer. The MPXHZ6401A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure.
MPXHZ6401A Rev 0, 05/2010
MPXHZ6401A Series
50 to 400 kPa (7.25 to 58.02 psi) 0.5 to 4.5 V Output
Features
* * * * * * Resistant to High Humidity and Common Automotive Media Improved Accuracy at High Temperature 1.5% Maximum Error over 0C to 85C Temperature Compensated from -40C to +125C Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional Axial Port Ideally Suited for Microprocessor or Microcontroller-Based Systems ORDERING INFORMATION
Device Name Device Type Options Package Options Rail Tape & Reel Case No. 1317 1317 Device Marking
Super Small Outline Package (MPXHZ6401A Series) MPXHZ6401A6U MPXHZ6401A6T1 Basic Element Absolute, Element Only Absolute, Element Only MPXHZ6401A MPXHZ6401A
SUPER SMALL OUTLINE PACKAGES
MPXHZ6401A6U/6T1 CASE 1317
(c) Freescale Semiconductor, Inc., 2010. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2.
Characteristic Pressure Range Supply Voltage(1) Supply Current Minimum Pressure Offset @ VS = 5.0 Volts(2) Full Scale Output @ VS = 5.0 Volts(3) Full Scale Span Sensitivity Accuracy(4) (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Symbol POP VS Io Voff VFSO VFSS V/P -- Min 50 4.75 -- 0.437 4.438 -- -- -1.58 Typ -- 5.0 6.0 0.5 4.501 4.0 11.43 -- Max 400 5.25 10 0.563 4.563 -- -- 1.58 Unit kPa Vdc mAdc Vdc Vdc V mV/kPa %VFSS
1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Scan (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of VFSS at 25C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: Offset Stability: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. Output deviation, after 1000 temperature cycles, -40C to 125C and 1.5 million pressure cycles, with minimum rated pressure applied. Output deviation over the temperature range of 0C to 85C, relative to 25C. Output deviation with minimum rated pressure applied, over the temperature range of 0C to 85C, relative to 25C.
MPXHZ6401A 2 Sensors Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset(2) Symbol Pmax Tstg TA I o+ Io Value 1200 -40 to +125 -40 to +125 +0.5 -0.5 Units kPa C C mAdc mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 2
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
4
VOUT
GND
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXHZ6401A Sensors Freescale Semiconductor 3
Pressure
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the configuration in the basic chip carrier (case 1317) prior to porting. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as common automotive media. NOTE: The MPXHZ6401A series pressure sensor's operating characteristics, internal reliability and qualification tests are based on use of air as the pressure media. Media, other than air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0C to 85C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Fluoro Silicone Gel Die Coat Die Wire Bond Lead Frame P1
Stainless Steel Cap Thermoplastic Case
+5.0 V
VS Pin 2 100 nF MPXHZ6401A Vout Pin 4 GND Pin 3 47 pF 51 K to ADC
Absolute Element Sealed Vacuum Reference
Die Bond
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit (Output Source Current Operation)
5.0
Vout = Vs * [(0.002286 * P) - 0.01429 5.5 * 0.002286 * Vs * Tm] 4.5 VS = 5.0 0.25 Vdc 4.0 Temperature = 0C to 85C 3.5 Output (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0 50 100 150 0 MIN MAX TYP
200
250
300
350
400
Pressure (kPa)
Figure 4. Output vs. Absolute Pressure
MPXHZ6401A 4 Sensors Freescale Semiconductor
450
Pressure
Temperature Error Band
MPXHZ6401A SERIES
4.0 3.0 Temperature Error Factor (Tm) 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C Break Points Temp - 40 0 to 85 125 Multiplier 3 1 1.75
Pressure Error Band
10 5 0 -5 -10 Error Limits for Pressure
Pressure Error (kPa)
50
100
150
200
250
300
350
400
Pressure (in kPa)
Pressure 50 to 400 (kPa)
Error (Max) 5.5 (kPa)
MPXHZ6401A Sensors Freescale Semiconductor 5
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a
0.050 1.27 TYP 0.150 3.81
solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.387 9.83
0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 5. SSOP Footprint (Case 1317)
MPXHZ6401A 6 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXHZ6401A Sensors Freescale Semiconductor 7
Pressure
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXHZ6401A 8 Sensors Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXHZ6401A Sensors Freescale Semiconductor 9
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2010. All rights reserved.
MPXHZ6401A Rev. 0 05/2010

▲Up To Search▲

Price & Availability of MPXHZ6401A

	To Download MPXHZ6401A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .